2UUL Hand Finish Blades For Phone Screen Debonding / Removal IC, Model:Y (2UUL)
2. The blade is from thin to thick, and the force is more uniform
3. It is suitable for removing glue from the screen and removing the CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc
4. Upgraded to a more practical bent-blade design, by bending the blade, the loss to the motherboard, chip, screen, etc is realized and reduced, thereby improving the yield
5. Nano-coating is anti-rust, the blade body is flexible, thin, and elastic, the thickness of the blade tip is equal to 0.06mm, and the thickness of the blade tail is about 0.3mm
ATTENTION: The availability of every product is referred in it and is analyzed below:
In stock: for the products that have at least one item in stock.
On Order: Refers to Products that aren't in stock and will be included in the next scheduled import if you proceed to your order. Shipping time of your order 7-15 working days. This time does not include the shipping time of the shipping method you have selected.
(Imports are being done every 7-15 business days).
If you want your order to come to your place directly, please choose products that are in stock and quantity lower or equal to the available one.
For orders above 80.00 € (value species VAT) we ship your order for free.
Offer applies only to shipments to Greece, does not cover expenses on delivery and not valid for Saturday shipments.
If your order is over two Kilograms (kg) then for every extra Kilogram there is a charge 1,00
