Findx F11-mini For iPhone 11 / 11 Pro / 11 Pro Max Reballing Stencil Platform Jig Fixture
1. Used to locate and relocate mobile phone PCB BGA parts
2. Convenient and quick re-bombardment of BGA without causing any damage, suitable for iPhone 11/11 Pro / 11 Pro Max BGA repositioning and repair to provide solutions
3. Unique hole design makes it easier to take out the formed solder balls
4. Fast and convenient soldering
5. Size: about 13x9x1.7cm
2. Convenient and quick re-bombardment of BGA without causing any damage, suitable for iPhone 11/11 Pro / 11 Pro Max BGA repositioning and repair to provide solutions
3. Unique hole design makes it easier to take out the formed solder balls
4. Fast and convenient soldering
5. Size: about 13x9x1.7cm
ATTENTION: The availability of every product is referred in it and is analyzed below:
In stock: for the products that have at least one item in stock.
On Order: Refers to Products that aren't in stock and will be included in the next scheduled import if you proceed to your order. Shipping time of your order 7-15 working days. This time does not include the shipping time of the shipping method you have selected.
(Imports are being done every 7-15 business days).
If you want your order to come to your place directly, please choose products that are in stock and quantity lower or equal to the available one.
