Findx F11-mini For iPhone 11 / 11 Pro / 11 Pro Max Reballing Stencil Platform Jig Fixture

On order (7-15 business days)
35.79
(with tax)
SK1413725
+
Our quantity discounts:
Quantity 5+ 10+ 30+ 50+
Price 33.28 32.57 31.50 30.42
1. Used to locate and relocate mobile phone PCB BGA parts
2. Convenient and quick re-bombardment of BGA without causing any damage, suitable for iPhone 11/11 Pro / 11 Pro Max BGA repositioning and repair to provide solutions
3. Unique hole design makes it easier to take out the formed solder balls
4. Fast and convenient soldering
5. Size: about 13x9x1.7cm

ATTENTION: The availability of every product is referred in it and is analyzed below:

In stock: for the products that have at least one item in stock.

On Order: Refers to Products that aren't in stock and will be included in the next scheduled import if you proceed to your order. Shipping time of your order 7-15 working days. This time does not include the shipping time of the shipping method you have selected.

(Imports are being done every 7-15 business days). 

If you want your order to come to your place directly, please choose products that are in stock and quantity lower or equal to the available one.

For orders above 80.00 € (value species VAT) we ship your order for free.

Offer applies only to shipments to Greece, does not cover expenses on delivery and not valid for Saturday shipments.

If your order is over two Kilograms (kg) then for every extra Kilogram there is a charge 1,00

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