2. Separation of dot matrix, glue removal from the bottom of the board, wire break assistance, removal of large chips
3. It is suitable for separating dot-matrix/board bottom glue removal/large chip removal/disconnection assistance, etc., to meet your maintenance needs
4. The blade is hardened, the cutting edge is ultra-thin, the slope on both sides is polished at the same time, and the blade is evenly stressed on both sides from thick to thin
5. Super toughness, better protection of mobile phone chips
6. With a universal handle, high-quality material selection, and a strong guarantee of product quality
7. Mobile phone repair commonly used blades, hard disk removal, removal of mobile phone chips, motherboard CPU layering
ATTENTION: The availability of every product is referred in it and is analyzed below:
In stock: for the products that have at least one item in stock.
On Order: Refers to Products that aren't in stock and will be included in the next scheduled import if you proceed to your order. Shipping time of your order 7-15 working days. This time does not include the shipping time of the shipping method you have selected.
(Imports are being done every 7-15 business days).
If you want your order to come to your place directly, please choose products that are in stock and quantity lower or equal to the available one.
For orders above 80.00 € (value species VAT) we ship your order for free.
Offer applies only to shipments to Greece, does not cover expenses on delivery and not valid for Saturday shipments.
If your order is over two Kilograms (kg) then for every extra Kilogram there is a charge 1,00