1. For Disassemble PCB Chips/Mobile Phone Frame
2. Heating plate with good and well-distributed heat conduction, will not be easy out of shape under high temperature
3. Thickened panel with pad
2. Heating plate with good and well-distributed heat conduction, will not be easy out of shape under high temperature
3. Thickened panel with pad
ATTENTION: The availability of every product is referred in it and is analyzed below:
In stock: for the products that have at least one item in stock.
On Order: Refers to Products that aren't in stock and will be included in the next scheduled import if you proceed to your order. Shipping time of your order 7-15 working days. This time does not include the shipping time of the shipping method you have selected.
(Imports are being done every 7-15 business days).
If you want your order to come to your place directly, please choose products that are in stock and quantity lower or equal to the available one.






