Mijing IPH-22 0.12mm CPU Comprehensive BGA Reballing Stencil for iPhone 16 Series (MIJING)
2. Enhanced Durability: The surface is specially treated to enhance wear resistance, prolonging the stencil's lifespan.
3. Made from high heat-resistant and non-deformable materials, ensuring long-term stability and reliability during use.
4. Easy Operation Design: The stencil design is user-friendly, suitable for all types of technicians, allowing operation without professional training.
5. Enhanced Soldering Quality: With precise hole design, it effectively improves soldering quality, preventing shorts and cold joints.
6. High-Temperature Resistance: Capable of withstanding high temperatures during the soldering process without deforming.
ATTENTION: The availability of every product is referred in it and is analyzed below:
In stock: for the products that have at least one item in stock.
On Order: Refers to Products that aren't in stock and will be included in the next scheduled import if you proceed to your order. Shipping time of your order 7-15 working days. This time does not include the shipping time of the shipping method you have selected.
(Imports are being done every 7-15 business days).
If you want your order to come to your place directly, please choose products that are in stock and quantity lower or equal to the available one.
For orders above 80.00 € (value species VAT) we ship your order for free.
Offer applies only to shipments to Greece, does not cover expenses on delivery and not valid for Saturday shipments.
If your order is over two Kilograms (kg) then for every extra Kilogram there is a charge 1,00
