Kaisi 18 in 1 Silicone Middle Layer Tin Planting BGA Reballing Platform for iPhone X-14 Pro Max (Kaisi)

Κατόπιν παραγγελίας (7-15 εργάσιμες ημέρες)
57.21
(με ΦΠΑ)
SK2815819
+
Ποσοτικές εκπτώσεις:
Ποσότητα 5+ 10+ 30+ 50+ 100+
Τιμή 53.35 52.21 51.63 51.06 50.49
  • Διαθεσιμότητα Προϊόντος
  • Ερώτηση για το προϊόν
  • Δωρεάν Αποστολή άνω των 80€

Περιγραφή

1. Middle layer tin planting platform set for iPhone X / XS / XS Max / 11 / 11 Pro / 11 Pro Max / 12 / 12 Mini / 12 Pro / 12 Pro Max / 13 / 13 Mini / 13 Pro / 13 Pro Max / 14 / 14 Plus / 14 Pro / 14 Pro Max
2. Super magnetic force / multi-model infinite extension base / precise positioning and close fit
3. Precise positioning / fast tin planting / strong magnetic adsorption
4. Built-in three high-temperature strong magnets, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetism
5. Steel material, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls
6. Anti-drum, so that each solder ball is round and full, to meet the needs of various chips
7. With precise positioning, it is more convenient to align the whole position
8. Silicone material is used to effectively isolate temperature and prevent scalding
9. The real machine is measured to ensure accuracy, and each detail, hole position, and mesh is proofread according to the original drawings to ensure that every solder joint cannot be missing

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