Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series (QIANLI)

Κατόπιν παραγγελίας (7-15 εργάσιμες ημέρες)
52.48
(με ΦΠΑ)
SK3128810
+
Ποσοτικές εκπτώσεις:
Ποσότητα 5+ 10+ 30+ 50+ 100+
Τιμή 48.70 47.66 47.13 46.61 46.09
  • Διαθεσιμότητα Προϊόντος
  • Ερώτηση για το προϊόν
  • Δωρεάν Αποστολή άνω των 80€

Περιγραφή

1. Middle frame reballing platform, precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge
2. To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space
3. Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take
4. CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing
5. Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken
6. High-temperature magnetic strong pressing prevents the stencils from bulging caused by high-temperature

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